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Responsibilities:

Product engineer responsible for CMOS image sensor
Schedule a characterization/testing plan and work with R&D teams and manufacturing engineers to resolve different technical issues, in order to meet performance requirements.
Participate in product definition and provide DFM inputs.
Work in close collaboration with silicon foundry, image characterization, and pixel design.
Interact with foundry fab in improving all silicon process, color, and package issues.
Improve product yield and performance by process optimization and layout design update.
Analyze yield and drive corrective actions for yield improvements.
Drive characterization to finalize the product datasheet.
Work with pixel design group to design the most sophisticated and optimized pixel layout.
Collaborate with characterization team to analyze and debug pixel device circuit and various image related issues.
Ramp up for image sensors and ASIC devices.
Coordinate with company's fab to drive semiconductor processing tool vendors to optimize processes.
Work with testing engineers to develop, verify, and release testing program at wafer level testing and final testing.

Qualifications:

5+ years experience with product engineer for semiconductor
Knowledge about semiconductor
Good communication and inter personal skills (English and Chinese ; business level, Japanese ; conversational level)
Result oriented and leading change behaviors
Experience / knowledge in CMOS Image Sensor is a plus
Project management experience with solid skill is a plus
Education: B.S. or M.S. in Electrical Engineering, Mechanical Engineering, Material Science (or equivalent practical experience).