8件のfab technology engineer, surface preparation and integrationのおすすめの求人

Device Engineer
onsemi —会津若松市
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5日前
Lead Fab Technology Engineer, Surface Preparation and Integration
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- 大卒

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Device Engineer

onsemi -
会津若松市

今すぐ応募する

求人の詳細

5日前

福利厚生

ビザサポートあり

資格とスキル

日本語
大卒
TOEIC

仕事内容の詳細

Background

Driven by strong and growing demand for power semiconductor devices, particularly in AI-related applications, improving factory productivity has become an urgent priority.

We are seeking talented engineers who can contribute broadly as Device Engineering / Process Integration Engineers , supporting activities ranging from new technology development and new product introduction to yield/quality improvement of mass production products, process optimization, cost reduction, and troubleshooting.

Responsibilities

Roles & Responsibilities

In an 8-inch wafer fabrication facility , you will act as a technology owner for Analog IC processes , leveraging expertise in device engineering and process integration to drive development and manufacturing excellence.

Lead and execute development and transfer projects for new technologies and new products
Improve product quality and yield through process design and optimization from development through mass production
Drive continuous improvement of quality, yield, and reliability for existing mass production products, contributing to technology robustness, cost reduction, and productivity enhancement
Manage manufacturing conditions for production products (Control Plans, FMEA, SPC)

Key Relationship

Direct Report: Manager, Device Engineering Department
Key Interfaces: Engineers and managers within Aizu Wafer Fab, Global Engineering Teams

Qualifications

Qualifications (Required)

Bachelor’s degree or higher in engineering or a related field
Experience in device engineering or process integration in a semiconductor wafer fabrication environment (Minimum ~5 years)
Fundamental knowledge of IC processes, device physics, electrical characteristics/testing, analog IC circuits, and reliability
Understanding of product specifications (SPEC) and design margin concepts
Hands-on experience in data analysis (yield, electrical characteristics, defect/failure analysis) and strong problem-solving skills
Practical experience in identifying root causes and implementing corrective actions for yield loss or performance issues
Experience leading cross-functional projects involving manufacturing, process engineering, design/product development, quality, and backend operations
Ability to communicate effectively in English (email and web meetings) with global teams and U.S. headquarters
- Business-level English proficiency (e.g., TOEIC score of ~600 or higher)
Japanese language proficiency (equivalent to JLPT N2 level or above)
Valid work authorization that permits employment in Japan at the time of application

Preferred Qualifications

Experience as a technical lead or engineer in new technology development or technology transfer projects
Experience in semiconductor circuit design, device simulation, or test development
Knowledge and hands-on experience with semiconductor front-end processes and equipment
Leadership experience in yield improvement or process optimization projects
Ability to communicate effectively in technical discussions in English meetings
Experience working in a multinational or global company environment is a plus

Ideal Candidate Profile

Continuously improves personal skills and can adapt to broader and deeper technical responsibilities
Understands factory and departmental KPIs and is committed to achieving them
Demonstrates strong ownership of products/technologies and drives problem-solving and improvements through to completion
Able to identify root causes and solve problems logically and systematically
Proactively identifies risks and implements preventive actions through risk assessment
Effectively communicates and collaborates across teams, influencing and leading stakeholders
Demonstrates flexibility and a positive attitude toward change and new technologies
Possesses a customer-oriented mindset and understands on-site realities, making decisions based on overall optimization rather than partial optimization

About Us

onsemi (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.

More details about our company benefits can be found here:

https://www.onsemi.com/careers/career-benefits

About the Team

We are committed to sourcing, attracting, and hiring high-performance innovators, while providing all candidates a positive recruitment experience that builds our brand as a great place to work.

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fab technology engineer, surface preparation and integration 件

Device Engineer

Lead Fab Technology Engineer, Surface Preparation and Integration

Process Support Engineer II

Principal Fab Technology Engineer

EPI Process Support Engineer II

Business & Operations Intern - Finance

(Sr. Staff / Staff Engineer) Process Integration Engineer

Photo Applications Manager

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